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41,816. Reads. 6,212. Citations. Introduction. Chih Chen received his Ph.D. and master degrees in Materials Science of University of California at Los Angeles (UCLA). He is currently a...
Professor. Department of Materials Science and Engineering. Center for Semiconductor Technology Research. https://orcid.org/0000-0001-6235-2827. Phone 03-5712121-31814. Email chihchen @ nycu.edu. tw. Website http://cpanel-199-19.nctu.edu.tw/~msecclab/. h-index.
Chen is the author/editor of more than 35 books and over 200 journal articles in areas of new information technologies, such as global digital libraries, multimedia technology, digital imaging, interactive videodisc technology, global information infrastructure, information management, and information resources.
2012. Electromigration and thermomigration in Pb-free flip-chip solder joints. C Chen, HM Tong, KN Tu. Annual Review of Materials Research 40, 531-555. , 2010. 297. 2010. Microstructure-electromigration correlation in a thin stripe of eutectic SnPb solder stressed between Cu electrodes. CY Liu, C Chih, CN Liao, KN Tu.
Biography. Chih Chen received the B.S. degree in materials science and engineering from National Tsing Hua University, Hsinchu, Taiwan, R.O.C., in 1992, the M.S. and Ph.D. degrees in materials science and engineering from University of California, Los Angeles, in 1996 and 1999, respectively.
Professor, Chairman for Department of Earth Sciences. Department of Earth Sciences. Earthquake-Disaster & Risk Evaluation and Management Center (E-DREaM) Email chienchih.chen @ g.ncu.edu. tw. Website https://www.gep.ncu.edu.tw/teacher?f1=0&f2=0. h-index.
Biography. Chih-Chiang Chen (Member, IEEE) received the Ph.D. degree in control theory from National Chiao Tung University, Hsinchu, Taiwan, in 2017. From 2015 to 2016, he was a Visiting Scholar with the Department of Electrical and Computer Engineering, University of Texas at San Antonio, USA.
