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  1. aiupbeat.com › building-better-with-ai-the-game-changing-innovations-reshapingBuilding Better with AI: The Game-Changing Innovations Reshaping...

    Hace 1 día · Designed by PLP Architecture and built by Dura Vermeer, The Edge utilizes advanced AI technologies to optimize building performance and user experience. The building features a sophisticated network of sensors that collect data on temperature, lighting, occupancy, and energy usage.

  2. Videos

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  3. benews.co.uk › informed › my-be-career-mark-kellyMy BE Career: Mark Kelly | BE News

    Hace 2 días · BE News Team. September 4, 2024. Share this: Name: Mark Kelly. Job title: Partner and chief operating officer, PLP Architecture. What I do: In my role as COO, I am responsible for shaping the business wide strategic direction of our global architecture and urban design practice, managing an incredibly talented and diverse team across our ...

  4. 247marketnews.com › onto-innovation-announces-opening-of-packaging-applicationsonto innovation announces opening of packaging applications...

    Hace 2 días · WILMINGTON, Mass.–(BUSINESS WIRE)–Onto Innovation Inc. today announced the opening of the company’s Packaging Applications Center of Excellence (PACE), a first-of-its-kind facility in the U.S. dedicated to panel-level packaging (PLP) innovations enabling 2.5D and 3D chiplet architectures and AI packages.Collaborating partners represent key process steps across the supply chain, ranging ...

  5. Imágenes

    • The Edge / PLP Architecture | ArchDaily
    • The Edge | PLP Architecture - Arch2O.com
    • The Edge | PLP Architecture - Arch2O.com
    • The Edge, Amsterdam by PLP Architecture - 谷德设计网
    • Gallery of The Edge / PLP Architecture - 2

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  6. investors.ontoinnovation.com › news › news-detailsOnto Innovation - Onto Innovation Announces Opening of Packaging...

    Hace 2 días · WILMINGTON, Mass.-- (BUSINESS WIRE)-- Onto Innovation Inc. (NYSE: ONTO) today announced the opening of the company’s Packaging Applications Center of Excellence (PACE), a first-of-its-kind facility in the U.S. dedicated to panel-level packaging (PLP) innovations enabling 2.5D and 3D chiplet architectures and AI packages.

  7. finance.yahoo.com › news › onto-innovation-announces-opening-packaging-111500367Onto Innovation Announces Opening of Packaging Applications...

    Hace 2 días · WILMINGTON, Mass., September 04, 2024--Onto Innovation Inc. (NYSE: ONTO) today announced the opening of the company’s Packaging Applications Center of Excellence (PACE), a first-of-its-kind ...

  8. semiengineering.com › chip-industry-week-in-review-51Chip Industry Week In Review - Semiconductor Engineering

    Hace 10 horas · Chip Industry Week In Review. New panel-level package center; global semi sales; Russian weapons with U.S. semis; Nvidia and Microsoft lawsuit; Hot Chips AI processors architectures; Intel’s 18A; Phil Kaufman winner; apprenticeships. Concerns mount on the use of American-manufactured semiconductors in Russian weapons, with Analog Devices, AMD ...

  9. www.suse.com › c › edge-computing-reference-architecture-with-rancher-and-linkerdEdge Computing Reference Architecture with Rancher and Li... -...

    Hace 2 días · Contact the Buoyant team and the SUSE team. To sum it up, combining Rancher Prime, Linkerd, RKE2 and K3s delivers a robust, observable, and easy-to-manage Edge computing solution. Organizations gain a powerful set of capabilities to improve edge computing performance and tackle the complexities and challenges of managing edge environments.