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Hace 3 días · El controlador bonding, originalmente creado por Donald Becker, está incluido en prácticamente todas las distribuciones de GNU/Linux y permite sumar las capacidades de varias interfaces físicas de red con objeto de crear una interfaz lógica.
Hace 3 días · You and your team can hit the trail, check out the wildlife, and bond while taking in amazing views. Simply pick a path, bring plenty of water and snacks, and set out together into the wilderness. Feel free to stop at scenic overlooks to take team photos.
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Hace 4 días · Pressing any attack twice in a row without jump/dash canceling will perform a unique Finishing Blow attack, causing a hard knockdown and leaving A.B.A at +23 instead of neutral (+-0). Similar to uncharged Dust but is slow enough for opponents to reliably react to.
Hace 1 día · X-Cube™ is a leap forward in advanced packaging, stacking logic dies on the Z-axis and increasing dynamic bonding capabilities. Samsung innovations to fast track its superior Chip-on-Wafer – elevating the X-Cube™ beyond speed or performance dips with even more chips per stack.
Hace 2 días · What is bonding capacity? Bonding capacity is the maximum amount of coverage a surety will provide to a company. Through investigating the financial standing, experience, and business practices of the company and its owners, the surety decides how much it’s willing to support them.
Hace 4 días · Bonding takes place when the wafers are placed between the chuck and the temperature is increased to just below the glass transition temperature of glass, followed by applying electric potential of several hundred volts.
