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  1. 18 de mar. de 2021 · Impedance spectroscopy performed on COF-5 thin films reveals that they are electronically insulating, ultra-low-k (k < 1.7) dielectric layers; these results are consistent with...

  2. Low-κ dielectric. In semiconductor manufacturing, a low-κ is a material with a small relative dielectric constant (κ, kappa) relative to silicon dioxide. Low-κ dielectric material implementation is one of several strategies used to allow continued scaling of microelectronic devices, colloquially referred to as extending Moore's law.

  3. 1 de ene. de 2004 · In principle, any material with a dielectric constant k lower than 4.2 is of interest (so called low-k dielectrics), but the k value is only one of many required properties. In this paper, we will briefly review ways of reducing k , survey the available low- k materials, and identify the problems associated with their integration in ...

  4. 1 de ene. de 2022 · Abstract. The need for ultra-low-k (ULK) materials in back-end-of-line integration is presented, in the context of the overall drive for performance enhancement and size scaling in semiconductor circuits. This is followed by an overview of dielectric materials, and the steady decrease in k-value, culminating in ULK materials.

  5. Towards this end, two major classes of low-k dielectric materials have been developed: organic materials that are inherently low-k owing to limited polarizabil-ity, and porous oxides that...

  6. 19 de ago. de 2019 · Two major changes concerned (i) the replacement of traditional dielectrics such as silicon oxide with “low-k” materials featuring a dielectric constant (or “ k -value”) <4.3 and (ii) the...

  7. Abstract. As the features of microprocessors are miniaturized, low-dielectric-constant (low-k) materials are necessary to limit electronic crosstalk, charge build-up, and signal propagation delay. However, all known low-k dielectrics exhibit low thermal conductivities, which complicate heat dissipation in high-power-density chips.